Manufacturing Process - メーカー・企業と製品の一覧

Manufacturing Processの製品一覧

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[Book] Introduction of IoT and AI to Factories and Manufacturing Processes (2055BOD)

[Book] Introduction of IoT and AI to Factories and Manufacturing Processes (2055BOD)

[Technical Specialty Books] ◎ How to Implement IoT and AI to Maximize the Use of Existing Equipment!!

Book Title: How to Introduce and Utilize IoT and AI in Factories and Manufacturing Processes －－－－－－－－－－－－－－－－－－－－－－－－－－ ◎Act immediately! No waste! Never stop! A comprehensive guide to realizing a smart factory!! －－－－－－－－－－－－－－－－－－－－－－－－－－ ●Publication Date: June 30, 2020 ●Authors: 52 ●Format: A4 size, 596 pages Hardcover Edition: Price: 88,000 yen (tax included) ISBN: 978-4-86104-791-6 　　↓↓ The hardcover edition is out of print ↓↓ On-Demand Edition Available 　　　　　 Price: 44,000 yen (tax included) ISBN: 978-4-86104-892-0 　　　　　 After receiving your order, we will print and bind it simply. －－－－－－－－－－－－－－－－－－－－－－－－－－

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Semiconductor manufacturing process TCB (Thermal Compression Bonding) release film "HR-S051"

Semiconductor manufacturing process TCB (Thermal Compression Bonding) release film "HR-S051"

Combining the thermal stability of PI and the release properties of PTFE! Suitable for preventing chip damage and contamination of bonding materials on press plates.

"HR-S051" is a release film that combines a polyimide film with a fluororesin (PTFE) layer. Due to its thinness, it has excellent thermal conductivity and can be used at high temperatures above 300°C. It possesses the thermal stability of PI and the release properties of PTFE, excelling in heat resistance, mechanical strength, dimensional stability, and release performance. 【Features】 ■ Combines the thermal stability (mechanical strength, dimensional stability) of polyimide with the release properties of PTFE ■ Excellent heat resistance, usable as a release film even at high temperatures of 300°C ■ Superior thermal conductivity due to its thinness *For more details, please refer to the PDF document or feel free to contact us.

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